The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Mar. 07, 2018
Applicant:
Shinkawa Ltd., Tokyo, JP;
Inventor:
Shoji Wada, Tokyo, JP;
Assignee:
SHINKAWA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/67 (2006.01); B23K 3/00 (2006.01); B29C 65/48 (2006.01); B29C 45/16 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68785 (2013.01); B23K 3/00 (2013.01); B29C 65/48 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); B29C 2045/14319 (2013.01); B29C 2045/1659 (2013.01);
Abstract
An apparatus for manufacturing a semiconductor device includes a base portion, a bonding stage arranged on the base portion and having a placement surface for placing a substrate; and one or more connecting members which connect the base portion and the bonding stage, wherein at least one of the one or more connecting members is a connecting plate that deflects following the expansion and contraction of the bonding stage in the plane direction caused by a temperature change.