The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Apr. 03, 2019
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Kazuhiro Ishikawa, Shiga, JP;

Takashi Hino, Yokohama, JP;

Shuichi Saito, Yokohama, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01J 37/32 (2006.01); C23C 14/08 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); B32B 18/00 (2006.01); C04B 41/00 (2006.01); C04B 41/50 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32477 (2013.01); B32B 18/00 (2013.01); C04B 41/009 (2013.01); C04B 41/5045 (2013.01); C04B 41/5055 (2013.01); C23C 14/083 (2013.01); C23C 16/45536 (2013.01); H01L 21/02252 (2013.01); H01L 21/3065 (2013.01);
Abstract

A plasma processing device member according to the disclosure includes a base material and a film formed of a rare-earth element oxide, or a rare-earth element fluoride, or a rare-earth element oxyfluoride, or a rare-earth element nitride, the film being disposed on at least part of the base material. The film includes a surface to be exposed to plasma, the surface having an arithmetic mean roughness Ra of 0.01 μm or more and 0.1 μm or less, the surface being provided with a plurality of pores, and a value obtained by subtracting an average equivalent circle diameter of the pores from an average distance between centroids of adjacent pores is 28 μm or more and 48 μm or less. A plasma processing device according to the disclosure includes the plasma processing device member described above.


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