The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Jul. 22, 2020
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Tetsuro Okada, Niigata, JP;

Naruhiro Hoshino, Niigata, JP;

Masahiko Ishida, Niigata, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C30B 29/06 (2006.01); C30B 35/00 (2006.01); C01B 33/035 (2006.01); C23C 16/24 (2006.01); C23C 16/455 (2006.01); H01R 4/00 (2006.01);
U.S. Cl.
CPC ...
C23C 16/458 (2013.01); C01B 33/035 (2013.01); C23C 16/24 (2013.01); C23C 16/45563 (2013.01); C30B 29/06 (2013.01); C30B 35/007 (2013.01); H01R 4/00 (2013.01);
Abstract

A polycrystalline silicon manufacturing apparatus according to the present invention may comprise an electrode adapter that electrically connects a core wire holder and a metal electrode, wherein the electrode adapter may be non-conductive with respect to a screwing part formed in the metal electrode. A polycrystalline silicon manufacturing apparatus according to the present invention may comprise an electrode adapter that electrically connects a core wire holder and a metal electrode, wherein the electrode adapter may be fixed to the metal electrode by a fixing mechanism part, and the electrode adapter may be non-conductive with respect to the fixing mechanism part.


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