The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Oct. 29, 2019
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Yoichiro Ichioka, Annaka, JP;
Kazunori Kondo, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 65/02 (2006.01); C08G 59/14 (2006.01); C08J 7/18 (2006.01); C08K 5/00 (2006.01); C08L 63/00 (2006.01); C08L 83/04 (2006.01);
U.S. Cl.
CPC ...
C08L 65/02 (2013.01); C08G 59/1411 (2013.01); C08G 59/1422 (2013.01); C08J 7/18 (2013.01); C08K 5/0025 (2013.01); C08L 63/00 (2013.01); C08L 83/04 (2013.01); C08L 2203/16 (2013.01); C08L 2203/202 (2013.01);
Abstract
A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.