The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Dec. 12, 2018
Applicant:
Namics Corporation, Niigata, JP;
Inventors:
Masashi Kajita, Niigata, JP;
Ayako Sato, Niigata, JP;
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 9/06 (2006.01); C09J 7/30 (2018.01); C08K 3/36 (2006.01); C08K 5/17 (2006.01); C08K 5/5425 (2006.01); C08K 5/5435 (2006.01); C09C 1/30 (2006.01); C09J 11/06 (2006.01); C09J 163/00 (2006.01); H01L 23/29 (2006.01); C09C 3/12 (2006.01); C08K 9/04 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08K 9/06 (2013.01); C08K 3/36 (2013.01); C08K 5/17 (2013.01); C08K 5/5425 (2013.01); C08K 5/5435 (2013.01); C08K 9/04 (2013.01); C08L 63/00 (2013.01); C09C 1/3063 (2013.01); C09C 3/12 (2013.01); C09J 7/30 (2018.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); H01L 23/295 (2013.01); C08K 2201/005 (2013.01);
Abstract
To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.