The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Jun. 26, 2018
Dupont Teijin Films U.s. Limited Partnership, Wilmington, DE (US);
Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v., Munich, DE;
John Fahlteich, Munich, DE;
Nicole Prager, Munich, DE;
Matthias Fahland, Munich, DE;
Olaf Zywitzki, Munich, DE;
Valentijn Von Morgen, Redcar Cleveland, GB;
Robert Eveson, Redcar Cleveland, GB;
DuPont Teijin Films U.S. Limited Partnership, Wilmington, DE (US);
Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V., Munich, DE;
Abstract
A method of preparing a multi-layer assembly, or of protecting a surface of a multi-layer substrate from damage and/or contamination and/or debris, said method comprising the steps of: (i) providing a composite film comprising a polymeric base layer having a first and second surface and disposed on the first surface thereof a polymeric protective layer having a first surface and a second surface such that the first surface of the said base layer is in contact with the first surface of the polymeric protective layer, wherein said polymeric protective layer comprises an ethylene-based copolymer, and preferably wherein the polymeric base layer comprises a polyester derived from one or more diol(s) and one or more dicarboxylic acid(s); (ii) removing said polymeric protective layer from the first surface of said base layer; (iii) disposing on the exposed first surface of said base layer one or more functional layers to provide a multi-layer substrate, wherein the, or at least the uppermost, functional layer comprises zinc and/or tin in an amount of from about 5 to about 80 wt % of said functional layer; and (iv) disposing a polymeric protective layer comprising an ethylene-based copolymer onto the exposed surface of the, or at least the uppermost, functional layer comprising zinc and/or tin to provide a multi-layer assembly.