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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11518066 B1

PDFFull Text
Date of Patent:
Dec. 06, 2022

Filed:

Oct. 12, 2020

Method of treating a solid layer bonded to a carrier substrate

Applicant:

Siltectra Gmbh, Dresden, DE;

Inventors:

Franz Schilling, Radeberg, DE;

Wolfram Drescher, Dresden, DE;

Jan Richter, Dresden, DE;

Assignee:

Siltectra GmbH, Dresden, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Linda L Gray

Int. Cl.
CPC ...
B28D 5/00 (2006.01); B23K 26/00 (2014.01); H01L 21/00 (2006.01); B81C 1/00 (2006.01); H01L 31/00 (2006.01); B23K 26/53 (2014.01); B28D 1/22 (2006.01); H01L 21/762 (2006.01); H01L 31/18 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B28D 5/0011 (2013.01); B23K 26/53 (2015.10); B28D 1/221 (2013.01); B81C 1/0038 (2013.01); B81C 1/00357 (2013.01); H01L 21/76251 (2013.01); H01L 31/1804 (2013.01); H01L 31/1896 (2013.01); B23K 2101/36 (2018.08); B81C 2201/0192 (2013.01); Y10T 156/1059 (2015.01);
Abstract

A method for treating a solid layer includes: providing a multi-layer assembly having a carrier substrate and a solid layer bonded to the carrier substrate by a bonding layer, the solid layer having an exposed surface including a defined surface structure, the defined surface structure resulting from a removal, which is effected by a crack, from a donor substrate, at least in sections; processing the solid layer, which is arranged on the carrier substrate; and separating the solid layer from the carrier substrate by a destruction of the bonding layer.

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Quick Actions:

Schilling, Franz. (2022). Method of treating a solid layer bonded to a carrier substrate (U.S. Patent No. 11518066). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11518066

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