The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Feb. 03, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventor:

Akira Nakamura, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/16 (2006.01); B24B 49/10 (2006.01); B24B 37/013 (2012.01); B24B 37/30 (2012.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 49/16 (2013.01); B24B 37/013 (2013.01); B24B 49/10 (2013.01); B24B 37/20 (2013.01); B24B 37/30 (2013.01);
Abstract

A novel polishing apparatus which determines a polishing end point of a substrate on the basis of a strain of a constituent element of the polishing apparatus caused by friction between a substrate such as a wafer and a polishing pad. The polishing apparatus includes a rotatable polishing table which supports a polishing pad, a polishing head which presses the substrate against the polishing pad, a rotating shaft connected to the polishing head, a support structure which rotatably supports the rotating shaft, a strain measuring instrument which measures a strain of the support structure, and an end point detector which determines a polishing end point of the substrate on the basis of a change in the strain. The strain measuring instrument includes at least one strain sensor fixed to the support structure.


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