The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Dec. 23, 2019
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yoshihiro Shinkai, Tokyo, JP;

Yuichiro Okuyama, Tokyo, JP;

Yusuke Ariake, Tokyo, JP;

Tomoya Hanai, Tokyo, JP;

Isao Kanada, Tokyo, JP;

Takashi Ohtsuka, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H05K 1/18 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H03H 7/1758 (2013.01); H05K 1/18 (2013.01); H01F 2017/0026 (2013.01); H01F 2017/0066 (2013.01); H03H 2001/0085 (2013.01); H05K 2201/08 (2013.01);
Abstract

An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.


Find Patent Forward Citations

Loading…