The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Dec. 12, 2019
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Venkata Naveen Kumar Neelapala, Hyderabad, IN;

Deepak Chandra Pandey, Almora, IN;

Naveen Kaushik, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10823 (2013.01); H01L 27/10808 (2013.01); H01L 27/10876 (2013.01); H01L 27/10891 (2013.01); H01L 29/4236 (2013.01);
Abstract

Systems, apparatuses, and methods related to semiconductor structure formation are described. An example apparatus includes a first trench and a second trench formed in a semiconductor substrate material, where the first and second trenches are adjacent and separated by the semiconductor substrate material. The apparatus includes a metallic material formed to a first height in the first trench that is less than, relative to the semiconductor substrate material, a second height of the metallic material formed in the second trench and a polysilicon material formed over the metallic material in the first trench to a first depth greater than, relative to the semiconductor substrate material, a second depth of the polysilicon material formed over the metallic material in the second trench. The greater first depth of the polysilicon material formed in the first trench reduces transfer of charge by way of the metallic material in the first trench.


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