The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Jul. 19, 2017
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Lakmal C. Kalutarage, San Jose, CA (US);
Mark Saly, Santa Clara, CA (US);
David Thompson, San Jose, CA (US);
Abhijit Basu Mallick, Palo Alto, CA (US);
Tejasvi Ashok, Fremont, CA (US);
Pramit Manna, Sunnyvale, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/22 (2006.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02274 (2013.01); H01L 21/0217 (2013.01); H01L 21/0234 (2013.01); H01L 21/02126 (2013.01); H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H01L 21/02208 (2013.01); H01L 21/02211 (2013.01); H01L 21/02323 (2013.01); H01L 21/02337 (2013.01); H01L 21/76224 (2013.01);
Abstract
Methods for seam-less gapfill comprising forming a flowable film by exposing a substrate surface to a silicon-containing precursor and a co-reactant are described. The silicon-containing precursor has at least one akenyl or alkynyl group. The flowable film can be cured by any suitable curing process to form a seam-less gapfill.