Semiconductor inspection device and probe unit

Abstract

Provided is a semiconductor inspection device capable of high-speed response analysis as defect analysis of a fine-structured device constituting an LSI. Therefore, the semiconductor inspection device includes a vacuum chamber, a sample tablewhich is disposed in the vacuum chamber and on which a sampleis placed, an electron optical systemdisposed such that an electron beam is emitted from above the sample, a plurality of probe unitsconnected to external devicesanddisposed outside the vacuum chamber via a coaxial cable, and an electrodeprovided on or in the vicinity of the sample table. The probe unitincludes a measurement probeconfigured to come into contact with the sample, a GND terminalconfigured to come into contact with the electrode, and a probe holderconfigured to hold the measurement probe and the GND terminal, connect a signal line of the coaxial cable to the measurement probe, and connect a GND line of the coaxial cable to the GND terminal. When the measurement probe of the probe unit comes into contact with the sample, the GND terminal comes into contact with the electrode.