The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Aug. 29, 2019
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Takayuki Nakada, Toyama, JP;

Takashi Nogami, Toyama, JP;

Tomoshi Taniyama, Toyama, JP;

Daigi Kamimura, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); H01L 21/205 (2006.01); H01L 21/67 (2006.01); C23C 16/44 (2006.01); C23C 16/54 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45502 (2013.01); C23C 16/4401 (2013.01); C23C 16/4412 (2013.01); C23C 16/54 (2013.01); H01L 21/205 (2013.01); H01L 21/67109 (2013.01); H01L 21/67739 (2013.01);
Abstract

A substrate processing apparatus includes: a substrate retainer configured to support a substrate; a heat-insulating unit; a transfer chamber; and a gas supply mechanism configured to supply a gas into the transfer chamber, the gas supply mechanism including: a first gas supply mechanism configured to supply the gas into an upper region of the transfer chamber, where the substrate retainer is disposed such that the gas flows horizontally through the upper region; and a second gas supply mechanism configured to supply the gas into a lower region of the transfer chamber, where the heat-insulating unit is provided such that the gas flows downward through the lower region, wherein the first gas supply mechanism and the second gas supply mechanism are disposed along a first sidewall of the transfer chamber, and the second gas supply mechanism is disposed lower than the first gas supply mechanism.


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