The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Dec. 11, 2019
Mitsubishi Materials Corporation, Tokyo, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
This free-cutting copper alloy contains Cu: 58.5 to 63.5%, Si: more than 0.4% and 1.0% or less, Pb: 0.003 to 0.25%, and P: 0.005 to 0.19%, with the remainder being Zn and inevitable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.40%, a total amount of Sn and Al is less than 0.40%, a relationship of 56.3≤f1=[Cu]−4.7×[Si]+0.5×[Pb]−0.5×[P]≤59.3 is satisfied, constituent phases of a metal structure have relationships of 20≤(α)≤75, 25≤(β)≤80, 0≤(γ)<2, 20≤(γ)×3+(β)×(−0.5×([Si])+1.5×[Si])≤78, and 33≤(γ)×3+(β)×(−0.5×([Si])+1.5×[Si])+([Pb])×33+([P])×14, and a compound including P is present in β phase.