The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Apr. 29, 2020
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Seoul National University R&db Foundation, Seoul, KR;

Inventors:

Keunwook Shin, Yongin-si, KR;

Kibum Kim, Seoul, KR;

Hyunmi Kim, Seoul, KR;

Hyeonjin Shin, Suwon-si, KR;

Sanghun Lee, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 29/16 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/5329 (2013.01); H01L 23/53204 (2013.01); H01L 24/19 (2013.01); H01L 29/1606 (2013.01);
Abstract

An interconnect structure may include a graphene-metal barrier on a substrate and a conductive layer on the graphene-metal barrier. The graphene-metal barrier may include a plurality of graphene layers and metal particles on grain boundaries of each graphene layer between the plurality of graphene layers. The metal particles may be formed at a ratio of 1 atom % to 10 atom % with respect to carbon of the plurality of graphene layers.


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