The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Mar. 31, 2022
Applicant:

Xintec Inc., Taoyuan, TW;

Inventors:

Yu-Tang Shen, New Taipei, TW;

Shun-Wen Long, Taoyuan, TW;

Chih-Hung Cho, Taoyuan, TW;

Hsing-Yuan Chu, Taoyuan, TW;

Assignee:

XINTEC INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); B81C 99/00 (2010.01);
U.S. Cl.
CPC ...
B81C 99/0025 (2013.01); B32B 43/006 (2013.01); B81C 2201/056 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1978 (2015.01);
Abstract

An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.


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