The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Feb. 26, 2021
Applicant:

Tokyo Seimitsu Co., Ltd., Tokyo, JP;

Inventors:

Takahiro Iida, Tokyo, JP;

Teruhiko Nishikawa, Tokyo, JP;

Tasuku Shimizu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 51/00 (2006.01); B26D 3/06 (2006.01); B26D 5/00 (2006.01); B26D 7/01 (2006.01); B24B 19/02 (2006.01); B23Q 15/26 (2006.01); B23Q 17/24 (2006.01); B23C 3/28 (2006.01);
U.S. Cl.
CPC ...
B26D 3/065 (2013.01); B23Q 15/26 (2013.01); B23Q 17/24 (2013.01); B24B 19/02 (2013.01); B24B 51/00 (2013.01); B26D 5/00 (2013.01); B26D 7/01 (2013.01); B23C 3/28 (2013.01); Y10T 83/0304 (2015.04);
Abstract

A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.


Find Patent Forward Citations

Loading…