The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
Nov. 15, 2019
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Tung-Tsun Chen, Hsinchu, TW;
Yi-Shao Liu, Zhubei, TW;
Jui-Cheng Huang, Hsinchu, TW;
Chin-Hua Wen, Toufen Township, TW;
Felix Ying-Kit Tsui, Cupertino, CA (US);
Yung-Chow Peng, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 19/00 (2006.01);
U.S. Cl.
CPC ...
B01J 19/0046 (2013.01); B01J 2219/00495 (2013.01); B01J 2219/00585 (2013.01); B01J 2219/00596 (2013.01); B01J 2219/00716 (2013.01); B01J 2219/00722 (2013.01);
Abstract
An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing areas. Each sensing area is between two adjacent rows of the rows of heating elements and between two adjacent columns of the columns of heating elements and includes a bio-sensing device and a temperature-sensing device.