The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Oct. 05, 2020
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Yuan He, Boise, ID (US);
Daigo Toyama, Kanagawa, JP;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 17/16 (2006.01); H01L 27/112 (2006.01); G11C 11/419 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11206 (2013.01); G11C 11/419 (2013.01); G11C 17/16 (2013.01);
Abstract
Apparatuses, methods, and computing systems relating to three-dimensional fuse architectures are disclosed. An apparatus includes a semiconductor substrate, a fuse array on or in the semiconductor substrate, and fuse circuitry on or in the semiconductor substrate. The fuse array includes fuse cells. The fuse circuitry is configured to access the fuse cells. The fuse circuitry is offset from the fuse array such that the fuse circuitry is disposed between the semiconductor substrate and the fuse array, or the fuse array is disposed between the semiconductor substrate and the fuse circuitry.