The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
May. 14, 2020
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Kazuyuki Kubota, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/32 (2006.01); H01L 23/66 (2006.01); H04B 17/10 (2015.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H04B 17/102 (2015.01); H01L 2223/6677 (2013.01);
Abstract
A semiconductor apparatus includes an interconnect substrate which includes an antenna module region in which an antenna and a semiconductor integrated circuit electrically connected to the antenna are disposed, and at least one evaluation region situated next to the antenna module region and used to evaluate characteristics of the antenna, wherein the at least one evaluation region has at least one slit formed therein such that the slit includes at least a portion, situated opposite the antenna, of a boundary line that separates the antenna module region and the evaluation region from each other.