The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Jul. 01, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Thorsten Meyer, Regensburg, DE;

Thomas Behrens, Wenzenbach, DE;

Martin Gruber, Schwandorf, DE;

Thorsten Scharf, Lappersdorf, DE;

Peter Strobel, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/301 (2006.01); H01L 21/46 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 24/97 (2013.01); H01L 2224/95136 (2013.01);
Abstract

A method of mounting electronic components on one or more carrier bodies is disclosed. The method comprises providing a support body with at least one first alignment mark, mounting the one or more carrier bodies, each having at least one second alignment mark, on the support body by alignment between the at least one first alignment mark and the at least one second alignment mark. Thereafter, the method includes mounting the plurality of electronic components on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark.


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