The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Oct. 01, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Quan Qi, Beaverton, OR (US);
Carlton E. Hanna, Sunnyvale, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01); H05K 3/00 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H05K 1/183 (2013.01); H05K 3/4682 (2013.01); H01L 23/498 (2013.01); H01L 23/49822 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H05K 3/0097 (2013.01); H05K 3/205 (2013.01); H05K 3/4697 (2013.01); H05K 2201/0989 (2013.01); H05K 2201/10674 (2013.01);
Abstract
Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.