The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
May. 31, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/8238 (2006.01); H01L 23/528 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823892 (2013.01); H01L 21/76805 (2013.01); H01L 21/76832 (2013.01); H01L 21/76867 (2013.01); H01L 21/76883 (2013.01); H01L 23/5283 (2013.01); H01L 23/5286 (2013.01); H01L 27/092 (2013.01);
Abstract
Some embodiments include an apparatus having a well region extending into a semiconductor substrate. A first conductive element is over the well region, and a second conductive element is over the first conductive element. A hole extends through the first conductive element. A connecting element extends from the second conductive element to the well region, and passes through the hole.
Yokoyama, Nanae. (2022). Apparatuses having an interconnect extending from an upper conductive structure, through a hole in another conductive structure, and to an underlying structure (U.S. Patent No. 11502006). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11502006
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile