The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Sep. 15, 2017
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventor:

Norikiyo Nakagawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/033 (2006.01); G03F 7/11 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/033 (2013.01); G03F 7/11 (2013.01); G03F 7/202 (2013.01);
Abstract

An ablation layer for a photosensitive resin for a relief printing plate, the ablation layer containing at least an acid-modified polymer and an infrared-absorbing agent and having a layer acid value as defined below of 2 mg KOH/g or more and 400 mg KOH/g or less, and a neutralized salt ratio as defined below of 0.9 or less, wherein the Layer acid value=(Acid value of the acid-modified polymer)×(Mass ratio of the acid-modified polymer to an entire ablation layer); and wherein the Neutralized salt ratio=(Number of moles of polymer wherein acid in the acid-modified polymer exists in neutralized salt state)/(Total number of moles of the acid-modified polymer).


Find Patent Forward Citations

Nakagawa, Norikiyo. (2022). Ablation layer, photosensitive resin structure, method for producing relief printing plate using said photosensitive resin structure (U.S. Patent No. 11500287). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11500287

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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