The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Oct. 23, 2020
King Yuan Electronics Co., Ltd., Hsinchu, TW;
Chia-Hung Tsai, Hsinchu, TW;
Kuo-Jung Wu, Hsinchu, TW;
Hsing-Yueh Liang, Hsinchu, TW;
Po-Wei Liao, Hsinchu, TW;
Yi-Ting Wang, Hsinchu, TW;
KING YUAN ELECTRONICS CO., LTD., Hsinchu, TW;
Abstract
A semiconductor component burn-in test module includes a burn-in board and an external power transmission component. The burn-in board includes a plurality of burn-in seats, wherein a plurality of chips are disposed on the burn-in seats. The external power transmission component is arranged at opposite two sides of the burn-in board, where the external power transmission component includes a plurality of conductive members and a plurality of terminal seats. The burn-in board is provided with a plurality of wirings corresponding to the external power transmission component. As such, electric power can be conveyed to the plural burn-in seats of the burn-in board, through the plural terminal seats and the plural conductive strips. This decreases the length and the number of copper foil wirings in the burn-in boards for power transmission, so as to lower the cost of the burn-in boards. Also disclosed is a semiconductor component burn-in test equipment using at least one semiconductor component burn-in test module.