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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11499070 B1

PDFFull Text
Date of Patent:
Nov. 15, 2022

Filed:

Jan. 19, 2016

Modified colloidal silica and method for producing the same, and polishing agent using the same

Applicant:

Fujimi Incorporated, Kiyosu, JP;

Inventors:

Keiji Ashitaka, Kiyosu, JP;

Shogo Tsubota, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Robert S Jones, Jr

Assistant Examiner:

Jiangtian Xu

Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 37/00 (2012.01); C01B 33/146 (2006.01); C09K 3/14 (2006.01); H01L 21/304 (2006.01); B24B 37/04 (2012.01); C01B 33/148 (2006.01); C01B 33/149 (2006.01); C07F 7/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/00 (2013.01); B24B 37/044 (2013.01); C01B 33/146 (2013.01); C01B 33/148 (2013.01); C01B 33/149 (2013.01); C07F 7/025 (2013.01); C09K 3/14 (2013.01); C09K 3/1436 (2013.01); H01L 21/304 (2013.01); H01L 21/31053 (2013.01); C01P 2004/03 (2013.01); C01P 2004/51 (2013.01); C01P 2004/61 (2013.01); H01L 21/76819 (2013.01);
Abstract

To provide modified colloidal silica capable of improving the stability of the polishing speed with time when used as abrasive grains in a polishing composition for polishing a polishing object that contains a material to which charged modified colloidal silica easily adheres, such as a SiN wafer, and to provide a method for producing the modified colloidal silica. Modified colloidal silica, being obtained by modifying raw colloidal silica, wherein the raw colloidal silica has a number distribution ratio of 10% or less of microparticles having a particle size of 40% or less relative to a volume average particle size based on Heywood diameter (equivalent circle diameter) as determined by image analysis using a scanning electron microscope.

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