The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Jul. 31, 2020
Applicant:

Unimicron Technology Corporation, Taoyuan, TW;

Inventors:

Yi Lin, Taipei, TW;

Hsiao-Han Huang, Taipei, TW;

Yu-Hsin Pan, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 1/115 (2013.01); H05K 3/10 (2013.01); H05K 3/4038 (2013.01); H05K 1/11 (2013.01); H05K 2201/09509 (2013.01);
Abstract

Carrier board structure with an increased core-layer trace area and method for manufacturing the same are introduced. The carrier board structure comprises a core layer structure, a first circuit build-up structure, and a second circuit build-up structure. The core layer structure comprises a core layer, a signal transmission portion, and an embedded circuit layer, wherein the signal transmission portion and the embedded circuit layer are disposed inside the core layer and electrically connected. The first circuit build-up structure is disposed on the core layer on a same side as the embedded circuit layer and is electrically connected to the embedded circuit layer. The second circuit build-up structure is disposed on the core layer on a same side as the signal transmission portion, and is electrically connected to the first circuit build-up structure through the signal transmission portion and the embedded circuit layer.


Find Patent Forward Citations

Lin, Yi. (2022). Carrier board structure with an increased core-layer trace area and method for manufacturing same (U.S. Patent No. 11497115). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11497115

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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