The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Mar. 23, 2021
Applicants:
Shinko Electric Industries Co., Ltd., Nagano, JP;
National University Corporation Yokohama National University, Kanagawa, JP;
Inventors:
Assignees:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
National University Corporation YOKOHAMA National University, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 5/378 (2015.01); H01Q 1/38 (2006.01); H01Q 1/40 (2006.01); H01Q 13/08 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 5/378 (2015.01); H01Q 1/38 (2013.01); H01Q 1/40 (2013.01); H01Q 13/08 (2013.01); H01Q 9/045 (2013.01);
Abstract
A sensor module includes: a metal member having a recessed portion; a resin portion embedded within the recessed portion; a radiator provided within the resin portion and configured to emit radio waves; a wireless communication portion provided within the resin portion and connected to the radiator; and a sensor connected to the wireless communication portion, wherein the metal member is insulated from the radiator by the resin portion and functions as a parasitic element.