The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Sep. 09, 2020
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventor:
Cheng-Che Lee, Taichung, TW;
Assignee:
Winbond Electronics Corp., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7684 (2013.01);
Abstract
Provided is a method for manufacturing a semiconductor device, including: forming a conductive layer on the first dielectric layer; forming a recess in the conductive layer; performing a first etching process to round a top corner of the recess; performing a second etching process to remove the conductive layer exposed from a bottom surface of the recess and thereby forming an opening having a rounding top corner in the conductive layer; and forming a second dielectric layer in the opening.