The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

May. 20, 2020
Applicant:

Phoenix & Corporation, Grand Cayman, KY;

Inventors:

Wen-Hung Hu, Hsinchu County, TW;

Tsung-Yueh Chen, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01F 7/06 (2006.01); H01F 41/04 (2006.01); H05K 1/16 (2006.01); H01L 23/498 (2006.01); H05K 3/30 (2006.01); H05K 3/00 (2006.01); H01L 21/48 (2006.01); H05K 3/46 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01F 7/06 (2013.01); H01F 41/041 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 33/58 (2013.01); H05K 1/165 (2013.01); H05K 1/187 (2013.01); H05K 3/0044 (2013.01); H05K 3/30 (2013.01); H05K 3/4644 (2013.01); H01F 2007/068 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/166 (2013.01);
Abstract

A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.


Find Patent Forward Citations

Loading…