The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Sep. 13, 2017
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
Ryuma Mizusawa, Kawasaki, JP;
Tomoyuki Ando, Kawasaki, JP;
TOKYO OHKA KOGYO CO., LTD., Kawasaki, JP;
Abstract
A substrate bonding method which enables forming a precision fine space using a method that is simpler and easier than conventional methods; and a laminated body production method that uses the substrate bonding method. This substrate bonding method includes disposing a first substrate on a photoresist pattern formed on a support film so as to bring the first substrate into contact with a surface of the photoresist pattern located on the side opposite to the support film, and pressure-bonding the support film, the photoresist pattern, and the first substrate; releasing the bonded support film after the pressure-bonding; and disposing a second substrate on the photoresist pattern so as to bring the second substrate into contact with the surface of the photoresist pattern located on the side opposite to the first substrate, and pressure-bonding the first substrate, the photoresist pattern, and the second substrate.