The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Mar. 24, 2021
Invensense, Inc., San Jose, CA (US);
Tdk Electronics Ag, Munich, DE;
Tsung Lin Tang, Hsinchu, TW;
Chia-Yu Wu, San Jose, CA (US);
Chung-Hsien Lin, Hsinchu, TW;
Dennis Mortensen, Munich, DE;
Pirmin Rombach, Kongens Lyngby, DK;
INVENSENSE, INC., San Jose, CA (US);
TDK ELECTRONICS AG, Munich, DE;
Abstract
Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments.