The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Aug. 29, 2017
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Paolo Tessariol, Montebelluna, IT;

Qiang Tang, Cupertino, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 27/112 (2006.01); H01L 23/535 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H01L 21/76895 (2013.01); H01L 23/5222 (2013.01); H01L 23/535 (2013.01); H01L 27/11286 (2013.01); H01L 28/86 (2013.01); H01L 28/90 (2013.01);
Abstract

Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes conductive materials located in different levels of the apparatus, dielectric materials located in different levels of the apparatus, a first conductive contact, and a second conductive contact. One of the conductive materials is between two of the dielectric materials. One of the dielectric materials is between two of the conductive materials. The first conductive contact has a length extending through the conductive materials and the dielectric materials in a direction perpendicular to the levels of the apparatus. The first conductive contact is electrically separated from the conductive materials. The second conductive contact contacts a group of conductive materials of the conductive materials.


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