The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jan. 31, 2020
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventors:

Chia-Lin Tsai, Taoyuan, TW;

Wun-Ye Ku, Taoyuan, TW;

Tien-Yu Chen, New Taipei, TW;

Chia-Yi Lin, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 31/3193 (2006.01); G01R 31/319 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07342 (2013.01); G01R 1/06711 (2013.01); G01R 31/31905 (2013.01); G01R 31/31935 (2013.01);
Abstract

A wafer test system includes a probe apparatus, a data server, an automation subsystem, and a probe mark assessment subsystem. The probe apparatus includes a probe card, a tester, and a camera. The probe card includes probe pins for contacting test pads in the wafer, and the camera captures an image of the test pads. The automation subsystem obtains an image specification from the probe apparatus and triggers an automated assessment of a probe mark in the image of the test pads. The probe mark assessment subsystem performs the automated assessment of the probe mark in the image of the test pads. The probe mark assessment subsystem performs an image-processing operation to obtain a probe mark assessment result, and the automation subsystem stops the probe apparatus if the probe mark assessment result indicates a probe test failure.


Find Patent Forward Citations

Loading…