The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Jan. 10, 2022
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Hoyoung Kang, Albany, NY (US);
Anton J. deVilliers, Clifton Park, NY (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25B 11/00 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B25B 11/005 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01); H01L 21/68785 (2013.01);
Abstract
An apparatus and method for uniformly holding a substrate without flexure or bending of the substrate, thereby enabling accurate shape measurements of the substrate such as wafer curvature, z-height values and other surface characteristics. Techniques include using a liquid as a supporting surface for a substrate thereby providing uniform support. Liquid used has a same specific gravity of a substrate being supported so that the substrate can float on the liquid without sinking. Uniform support of the substrate enables precision metrology.