The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
May. 14, 2020
Disco Corporation, Tokyo, JP;
Junsoo Woo, Tokyo, JP;
Toshiyuki Moriya, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A grinding apparatus has a hermetically sealed chamber defined by a portion of a holding surface which extends radially outwardly from a wafer, an outer wall surface of a first annular packing, a lower surface of a plate, and an inner wall surface of a second annular packing. A negative pressure is developed by suction forces applied from the holding surface, allowing the atmospheric pressure to press the plate toward the holding surface and causing the first annular packing to press an outer circumferential portion of the wafer against the holding surface. Since the outer circumferential portion of the wafer is pressed against the holding surface under the suction forces from the holding surface and the atmospheric pressure, the forces pressing the outer circumferential portion of the wafer against the holding surface are increased easily at a low cost without increasing the size and weight of the grinding apparatus.