The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Oct. 23, 2019
Applicant:

National Technology & Engineering Solutions of Sandia, Llc, Albuquerque, NM (US);

Inventors:

Giovanni Esteves, Albuquerque, NM (US);

Erica Ann Douglas, Albuquerque, NM (US);

Michael David Henry, Albuquerque, NM (US);

Benjamin Griffin, Arlington, VA (US);

Morgann Berg, Albuquerque, NM (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/18 (2006.01); H01L 41/12 (2006.01); H01L 41/04 (2006.01); H01L 41/20 (2006.01); H01L 41/06 (2006.01); H01L 41/09 (2006.01); H01L 41/083 (2006.01); H01L 41/08 (2006.01); H01L 41/27 (2013.01); H01L 41/37 (2013.01);
U.S. Cl.
CPC ...
H01L 41/0838 (2013.01); H01L 41/0805 (2013.01); H01L 41/0831 (2013.01); H01L 41/183 (2013.01); H01L 41/27 (2013.01); H01L 41/37 (2013.01);
Abstract

A metal stack for templating the growth of AlN and ScAlN films is disclosed. The metal stack comprises one, two, or three layers of metal, each of which is compatible with CMOS post-processing. The metal stack provides a template that promotes the growth of highly textured c-axis {002} AlN and ScAlN films. The metal stacks include one or more metal layers with each metal layer having either a hexagonal {002} orientation or a cubic {111} orientation. If the metal stack includes two or more metal layers, the layers can alternate between hexagonal {002} and cubic {111} orientations. The use of ScAlN results in a higher piezoelectric constant compared to that of AlN for ScAlN alloys up to approximately 44% Sc. The disclosed metal stacks resulted in ScAlN films having XRD FWHM values of less than approximately 1.1° while significantly reducing the formation of secondary grains in the ScAlN films.


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