The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Dec. 05, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Atsufumi Inoue, Tokyo, JP;

Tatsuro Watahiki, Tokyo, JP;

Kengo Matsufuji, Tokyo, JP;

Kojiro Hara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/45 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 21/04 (2006.01); H01L 23/532 (2006.01); H01L 29/417 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/45 (2013.01); H01L 21/02178 (2013.01); H01L 21/0485 (2013.01); H01L 23/53223 (2013.01); H01L 29/401 (2013.01); H01L 29/41725 (2013.01); H01L 29/66348 (2013.01); H01L 29/7397 (2013.01); H01L 29/7813 (2013.01);
Abstract

An object is to provide a semiconductor device that can prevent organic contamination of an electrode including a plurality of laminated metal layers. A semiconductor device includes: a semiconductor substrate; and an electrode including a plurality of layers laminated on a principal surface of the semiconductor substrate. The electrode includes: a first metal layer in contact with the principal surface of the semiconductor substrate, the first metal layer containing Al; an oxide layer formed on a surface of the first metal layer, the oxide layer containing a metal and oxygen; and a second metal layer formed on a surface of the oxide layer. Concentrations of the oxygen in the oxide layer are higher than or equal to 8.0×10/cmand lower than or equal to 4.0×10/cm.


Find Patent Forward Citations

Loading…