The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Aug. 23, 2018
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Mika Kobune, Tokyo, JP;
Michiaki Yajima, Tokyo, JP;
Assignee:
SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); H01L 21/4882 (2013.01); H01L 23/3675 (2013.01);
Abstract
A method of manufacturing a semiconductor device includes: adhering together a heat generating body and a heat dissipating body via a thermally conductive sheet by applying a pressure on the heat generating body and the heat dissipating body in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C., and a tack strength of 5.0 N·mm or more at 25° C.