The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Dec. 11, 2019
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Keiichiro Oishi, Sakai, JP;

Kouichi Suzaki, Sakai, JP;

Hiroki Goto, Sakai, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/04 (2006.01); C21D 9/00 (2006.01); C22F 1/08 (2006.01);
U.S. Cl.
CPC ...
C22C 9/04 (2013.01); C21D 9/00 (2013.01); C22F 1/08 (2013.01);
Abstract

This free-cutting copper alloy includes Cu: more than 61.0% and less than 65.0%, Si: more than 1.0% and less than 1.5%, Pb: 0.003% to less than 0.20%, and P: more than 0.003% and less than 0.19%, with the remainder being Zn and unavoidable impurities, a total content of Fe, Mn, Co, and Cr is less than 0.40%, a total content of Sn and Al is less than 0.40%, a relationship of 56.5≤f1=[Cu]−4.5×[Si]+0.5×[Pb]−[P]≤59.5 is satisfied, constituent phases of a metallographic structure have relationships of 20≤(α)≤80, 15≤(β)≤80, 0≤(γ)<8, 18×(γ)/(β)<9, 20≤(γ)×3+(β)×([Si])≤88, and 33≤(γ)×3+(β)×([Si])+([Pb])×35+([P])×15, and a compound including P is present in β phase.


Find Patent Forward Citations

Oishi, Keiichiro. (2022). Free-cutting copper alloy and method for manufacturing free-cutting copper alloy (U.S. Patent No. 11479834). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11479834

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