The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Dec. 20, 2018
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/10 (2006.01); C09J 7/10 (2018.01); C08L 33/10 (2006.01); C08L 63/10 (2006.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01);
U.S. Cl.
CPC ...
C09J 133/10 (2013.01); C08L 33/10 (2013.01); C08L 63/10 (2013.01); C09J 7/10 (2018.01); C09J 11/04 (2013.01); C09J 11/08 (2013.01); C08L 2203/16 (2013.01); C09J 2301/208 (2020.08);
Abstract
The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.