The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
Sep. 07, 2018
Applicant:
Rogers Germany Gmbh, Eschenbach, DE;
Inventors:
Johannes Wiesend, Speinshart, DE;
Heiko Schweiger, Oberbibrach, DE;
Assignee:
ROGERS GERMANY GMBH, Eschenbach, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); H01L 23/3672 (2013.01); H01L 23/3735 (2013.01); H01S 5/02492 (2013.01);
Abstract
An adapter element () for connecting a component (), such as a laser diode, to a heat sink (), comprising: a first metal layer (), which in a mounted state faces the component (), and a second metal layer (), which in the mounted state faces the heat sink (), and an intermediate layer () comprising ceramic arranged between the first metal layer () and the second metal layer (), wherein the first metal layer () and/or the second metal layer () is thicker than 40 μm, preferably thicker than 70 μm and more preferably thicker than 100 μm.