The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2022
Filed:
May. 06, 2020
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Frank Robert Libsch, White Plains, NY (US);
Ali Afzali-Ardakani, Ossining, NY (US);
James B. Hannon, Mahopac, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 23/538 (2006.01); G11C 16/04 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G02B 6/428 (2013.01); G02B 6/4269 (2013.01); G02B 6/4279 (2013.01); G11C 16/0416 (2013.01); H01L 23/3675 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/165 (2013.01); H01L 33/483 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6694 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1451 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract
An interconnect for a semiconductor device includes: a carrier; a UV programmable chip mounted on the carrier using a first array of solder connections; a UV light source mounted on the carrier using a second array of solder connections, the UV light source being in optical communication with the UV programmable chip; and a plurality of transmission lines extending on or through the carrier and providing electrical communication between the UV programmable chip and the UV light source.