The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Mar. 08, 2021
Applicant:

Nissin Ion Equipment Co., Ltd., Koka, JP;

Inventors:

Masakazu Adachi, Koka, JP;

Shinsuke Inoue, Koka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01);
Abstract

A wafer separating apparatus and method are provided. The apparatus includes an electrostatic chuck, a separation structure and a control device. The electrostatic chuck electrostatically supports a wafer during wafer processing using a voltage having a polarity. The separation structure mechanically separate the wafer from the electrostatic chuck. The control device controls the electrostatic chuck to, after the wafer processing is completed, reduce a magnitude of the voltage with the polarity while the separation structure applies a force to the wafer to separate the wafer from the electrostatic chuck.


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