The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Oct. 23, 2017
Applicant:

Namics Corporation, Niigata, JP;

Inventors:

Kazuki Iwaya, Niigata, JP;

Fuminori Arai, Niigata, JP;

Assignee:

NAMICS CORPORATION, Niigata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/26 (2006.01); C08G 59/68 (2006.01); C08G 59/66 (2006.01); C08G 59/24 (2006.01); C09J 163/02 (2006.01); C08L 63/02 (2006.01); H01L 23/29 (2006.01); C08L 63/00 (2006.01); C08K 5/00 (2006.01); C08K 5/3445 (2006.01); C08K 5/5419 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 27/26 (2013.01); B32B 27/38 (2013.01); C08G 59/66 (2013.01); C08G 59/68 (2013.01); C08K 5/0025 (2013.01); C08K 5/3445 (2013.01); C08K 5/5419 (2013.01); C09J 163/00 (2013.01); C08L 2203/206 (2013.01); C08L 2312/00 (2013.01); H01L 23/29 (2013.01);
Abstract

Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CHOR)(CHOR)(CHOR)(CHOR) (wherein R, R, Rand Rare each independently hydrogen or CHSH (wherein n is 2 to 6), at least one of R, R, Rand Ris CHSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.


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