The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2022

Filed:

Apr. 01, 2019
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Kazuya Hirata, Tokyo, JP;

Ryohei Yamamoto, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02013 (2013.01); H01L 29/1608 (2013.01);
Abstract

A method of producing a wafer from a hexagonal single-crystal ingot includes the steps of planarizing an end face of the hexagonal single-crystal ingot, forming a peel-off layer in the hexagonal single-crystal ingot by applying a pulsed laser beam whose wavelength is transmittable through the hexagonal single-crystal ingot while positioning a focal point of the pulsed laser beam in the hexagonal single-crystal ingot at a depth corresponding to a thickness of a wafer to be produced from the planarized end face of the hexagonal single-crystal ingot, recording a fabrication history on the planarized end face of the hexagonal single-crystal ingot by applying a pulsed laser beam to the hexagonal single-crystal ingot while positioning a focal point of the last-mentioned pulsed laser beam in a device-free area of the wafer to be produced.


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