The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2022

Filed:

Jun. 28, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Daisuke Toriya, Nirasaki, JP;

Toshiaki Fujisato, Nirasaki, JP;

Yuichi Furuya, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/46 (2006.01); C23C 16/44 (2006.01); H01L 21/687 (2006.01); C23C 16/448 (2006.01);
U.S. Cl.
CPC ...
C23C 16/46 (2013.01); C23C 16/448 (2013.01); C23C 16/4411 (2013.01); C23C 16/4412 (2013.01); C23C 16/466 (2013.01); H01L 21/68721 (2013.01); H01L 21/68742 (2013.01);
Abstract

There is provided a film-forming apparatus including: a processing container, wherein a reaction gas is supplied into the processing container; a stage disposed inside the processing container and provided with a substrate heating part, the stage being configured to place a substrate thereon; a support member configured to support the stage from a rear surface of the stage, wherein the rear surface faces a placement surface on which the substrate is placed; a temperature control member disposed on the rear surface of the stage and including a hollow portion formed to cover the support member, the temperature control member configured to have a controllable temperature; a heat-insulating member disposed between the stage and the temperature control member; and a purge gas supply part configured to supply a purge gas to a first gap formed between the support member and the temperature control member.


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