The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Mar. 30, 2018
Applicant:

Flosfia Inc., Kyoto, JP;

Inventors:

Shingo Yagyu, Kyoto, JP;

Takuto Igawa, Kyoto, JP;

Toshimi Hitora, Kyoto, JP;

Assignee:

FLOSFIA INC., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 8/0228 (2016.01); H01M 8/026 (2016.01); H01M 8/0206 (2016.01); C23C 16/448 (2006.01); C23C 16/40 (2006.01); H01M 8/0215 (2016.01); H01M 8/10 (2016.01); H01M 8/021 (2016.01);
U.S. Cl.
CPC ...
H01M 8/0228 (2013.01); C23C 16/405 (2013.01); C23C 16/407 (2013.01); C23C 16/4486 (2013.01); H01M 8/026 (2013.01); H01M 8/0206 (2013.01); H01M 8/0215 (2013.01); H01M 8/021 (2013.01); H01M 2008/1095 (2013.01);
Abstract

In a first aspect of a present inventive subject matter, a multilayer structure includes a base with a surface and an electrically-conductive metal oxide film that is positioned directly or via another layer on the base. At least a part of the surface of the base contains as a major component at least one selected from the group of copper, copper alloy, aluminum, aluminum alloy, magnesium, magnesium alloy, and stainless steel. The electrically-conductive metal oxide film is 30 nm or more in thickness. The multilayer structure is electrically-conductive and has a contact resistance that is 100 mΩcmor less.


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