The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Oct. 21, 2020
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Ryo Fukasawa, Nagano, JP;
Tomoo Yamasaki, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/24 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01);
Abstract
An interconnect substrate includes an insulating layer and an interconnect layer formed on a surface of the insulating layer, wherein the surface of the insulating layer has grooves formed therein, the grooves having a meander shape on an order of nanometers in a plan view, and wherein the interconnect layer has anchor portions fitted into the grooves.