The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Feb. 12, 2021
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
Kirubakaran Periyannan, Santa Clara, CA (US);
Daniel Linnen, Naperville, IL (US);
Jayavel Pachamuthu, San Jose, CA (US);
Assignee:
Western Digital Technologies, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); H01L 24/05 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/0807 (2013.01); H01L 2224/08145 (2013.01);
Abstract
A semiconductor device including an integrated module formed of a first semiconductor die coupled to a second semiconductor die. Each of the first and second semiconductor dies includes a number of bond pads, which are bonded to each other to form the integrated module. Each bond pad may be divided into a number of discrete pad legs. While the overall footprint of each bond pad on the first and second semiconductor dies may be the same, the bond pads on one of the dies may have a larger number of pad legs.